Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

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ژورنال

عنوان ژورنال: IEEE Transactions on Components, Packaging and Manufacturing Technology

سال: 2012

ISSN: 2156-3950,2156-3985

DOI: 10.1109/tcpmt.2011.2171485